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Tuesday, March 3 2020
4:30pm - 6:00pm
Marcus Nanotechnology Building, Room 1118
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X-Factor: How X-ray Technology is Improving the Electronics Assembly Process

1895 was the year Wilhelm Roentgen discovered a mysterious light that allowed him to see through objects – he called it X-rays. Since then, X-rays have been adopted in a wide range of applications in the electronics assembly process.

This presentation will cover:

  • Incorporation of AI (Artificial Intelligence) in X-ray inspection.
  • Electronic component inspection and failure analysis.
  • Component counting and material management.
  • Reverse engineering.
  • Counterfeit detection.
  • Real-time defect verification.
  • Computed tomography (CT) techniques and 2D, 2.5D, and 3D X-ray inspection.
  • Design for manufacturing (DFM) and design for x-ray inspection (DFXI).
  • Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC).

We’ll examine real life cases of how a team of scientists is using Artificial Intelligence to solve the most challenging applications in X-ray inspection

Speaker: Bill Cardoso, CEO of Creative Electron

Cardoso has a PhD degree in Electrical and Computer Engineering from Illinois Institute of Technology, as well as an MBA degree from University of Chicago. He started Creative Electron in 2008 in his garage. After 10 years, Creative Electron has become the largest U.S. manufacturer of X-ray systems to the electronics industry. Electron’s fast growth has been driven by its artificial intelligence expertise combined with a core competency in x-ray inspection. At Creative Electron, Cardoso leads the team of engineers and scientists who combine AI and X-rays to deliver the most intelligent X-ray machines in the market.

Dinner will be served.